FreshPatents.com: Abrading - USPTO Class 451 Patent Applications Update http://www.freshpatents.com/Abrading-dtnewntc451.php USPTO Class 451 - Abrading en-us Mon, 17 Jun 2013 13:40:59 -0700 1000 Wednesday Thursday Friday Saturday Sunday FreshPatents.com 141 31 http://www.freshpatents.com/index.php?rss=true http://www.freshpatents.com/images/freshpatentsnav_rss.gif Method of making diagram for use in selection of wavelength of light for polishing endpoint detection, method and apparatus for selecting wavelength of light for polishing endpoint detection, polishing endpoint detection method, polishing endpoint detecti http://www.freshpatents.com/-dt20130613ptan20130149938.php Mon, 17 Jun 2013 13:40:59 -0700 A method of producing a diagram for use in selecting wavelengths of light in optical polishing end point detection is provided. The method includes polishing a surface of a substrate having a film by a polishing pad; applying light to the surface of the substrate and receiving reflected light from... Large scale plate and method for uniformly polishing large scale plate http://www.freshpatents.com/-dt20130613ptan20130149939.php Mon, 17 Jun 2013 13:40:59 -0700 Disclosed is a substrate polishing method capable of minimizing a difference of polishing amounts between a center portion and a rim portion of a large scale plate during a plate polishing process.... Device for shot-peening a metal substrate, the surface of which is predetermined by masking using a screen consisting of a removable adhesive material http://www.freshpatents.com/-dt20130613ptan20130149940.php Mon, 17 Jun 2013 13:40:59 -0700 The invention relates to a device for shot-peening a metal substrate, the surface of which is predetermined by masking using a screen consisting of a removable adhesive material. Said method is particularly suitable for the low-cost production of a pattern on objects such as a metal tile, trash cans, and... Method of machining semiconductor substrate and apparatus for machining semiconductor substrate http://www.freshpatents.com/-dt20130613ptan20130149941.php Mon, 17 Jun 2013 13:40:59 -0700 A method of machining a semiconductor substrate using a soft polishing pad and an apparatus for machining a semiconductor substrate which has a soft polishing pad. The method includes the steps of lapping a surface of the semiconductor substrate, and polishing the lapped surface of the semiconductor substrate. The step... Inner retaining ring and outer retaining ring for carrier head http://www.freshpatents.com/-dt20130613ptan20130149942.php Mon, 17 Jun 2013 13:40:59 -0700 An inner ring for a carrier head has an inner surface configured to circumferentially surround the edge of a substrate positioned on the substrate mounting surface, an outer surface, and a lower surface to contact a polishing pad. An outer ring for a carrier head has an inner surface circumferentially... Device for preventing removal of a fixing member of a whetstone cover in a disc grinder http://www.freshpatents.com/-dt20130613ptan20130149943.php Mon, 17 Jun 2013 13:40:59 -0700 In a configuration in which a fixing screw is tightened and fixed between opposite ends of an attaching section of a whetstone cover, the fixing screw can be prevented from being removed from the end of the attaching section by fitting a rubber ring to a threaded shank of the... Polishing apparatus with dustproof housing http://www.freshpatents.com/-dt20130613ptan20130149944.php Mon, 17 Jun 2013 13:40:59 -0700 A polishing apparatus includes at least one dustproof housing, at least one polishing wheel, and at least one exhaust tube. Each dustproof housing includes a back wall, a plurality of sidewalls extending from the periphery of the back wall, and a front wall opposite to the back wall. The front... Polishing systems http://www.freshpatents.com/-dt20130613ptan20130149945.php Mon, 17 Jun 2013 13:40:59 -0700 Described herein are polishing apparatus, polishing formulations, and polymeric substrates for use in polishing surfaces, and related methods. The apparatus, formulations, substrates, and methods may each be used in applications involving the polishing of metal and/or metal-containing surfaces such as semiconductor wafers. The apparatus, formulations, polymeric substrates, and related methods...