http://www.freshpatents.com/Electrical-resistors-dtnewntc338.php USPTO Class 338 - Electrical resistors en-us Wed, 30 Apr 2008 12:30:18 -0700 1000 Wednesday Thursday Friday Saturday Sunday 141 31 http://www.freshpatents.com/index.php?rss=true http://www.freshpatents.com/images/freshpatentsnav_rss.gif http://www.freshpatents.com/Semiconductor-strain-sensor-dt20080424ptan20080094167.php Wed, 30 Apr 2008 12:30:18 -0700 An SOI substrate includes a thin diaphragm portion that is formed by removing a portion of the substrate from a rear surface side, and a thick outer frame portion that surrounds the diaphragm portion. A piezoresistive element that outputs an electrical signal in response to pressure is formed on the... http://www.freshpatents.com/Encapsulated-metal-resistor-dt20080424ptan20080094168.php Wed, 30 Apr 2008 12:30:18 -0700 The method provides a semiconductor structure and method for forming such a structure that provides for protection for resistive layers formed within the structure from contamination from adjacent layers. By encapsulating the resistive layer in a material that is resistant to the diffusion of contaminants it is possible to protect... http://www.freshpatents.com/Chip-shaped-electronic-part-dt20080424ptan20080094169.php Wed, 30 Apr 2008 12:30:18 -0700 A chip-shaped electronic part includes: a substrate; a pair of upper surface electrodes formed on an upper surface of the substrate; a functional element formed to be electrically connected to the upper surface electrode pair; a pair of lower surface electrodes formed on a lower surface of the substrate at...