http://www.freshpatents.com/Electricity--conductors-and-insulators-dtnewntc174.php USPTO Class 174 - Electricity: conductors and insulators en-us Thu, 24 Jul 2008 14:54:43 -0700 1000 Wednesday Thursday Friday Saturday Sunday 141 31 http://www.freshpatents.com/index.php?rss=true http://www.freshpatents.com/images/freshpatentsnav_rss.gif http://www.freshpatents.com/Electrical-box-guard-dt20080717ptan20080169115.php Thu, 24 Jul 2008 14:54:43 -0700 A flexible insert or guard has an elongated plastic body having a length to cover an opening of an electrical box and having two prongs or posts extending outwardly from the body for insertion into spaced apart mounting holes of the electrical box. The elongated plastic body flares outwardly at... http://www.freshpatents.com/Power-supply-device-dt20080717ptan20080169127.php Thu, 24 Jul 2008 14:54:43 -0700 The afore-mentioned object can be achieved by a power supply device, which includes a protector for receiving a wiring harness and extending the floating wiring harness through an elongated opening therein, a harness winding section free to bend the wiring harness to regulate a minimum radius of curvature of the... http://www.freshpatents.com/Cable-enclosure-assemblies-and-methods-for-using-the-same-dt20080717ptan20080169116.php Thu, 24 Jul 2008 14:54:43 -0700 According to embodiments of the present invention, a cable sealing assembly for providing an environmental seal about a cable includes a housing, a flowable cable sealant and a compression feature. The housing includes first and second housing parts. The first housing part defines a cable passage to receive a cable... http://www.freshpatents.com/Bonding-pad-structure-for-back-illuminated-optoelectronic-device-and-fabricating-method-thereof-dt20080717ptan20080169117.php Thu, 24 Jul 2008 14:54:43 -0700 A bonding pad structure for an optoelectronic device. The bonding pad structure comprises a carrier substrate having a bonding pad region and an optoelectronic device region. An insulating layer is disposed on the carrier substrate, having an opening corresponding to the bonding pad region. A bonding pad is embedded in... http://www.freshpatents.com/Wire-structure-and-semiconductor-device-comprising-the-the-wire-structure-dt20080717ptan20080169118.php Thu, 24 Jul 2008 14:54:43 -0700 Provided are a wire structure and a semiconductor device having the wire structure. The wire structure includes a first wire that has a first region having a width of several to tens of nanometers and a second region having a width wider than that of the first region.... http://www.freshpatents.com/Method-and-device-for-repair-of-a-contact-pad-of-a-printed-circuit-board-dt20080717ptan20080169119.php Thu, 24 Jul 2008 14:54:43 -0700 Methods and devices are provided for repairing a damaged contact pad that is located on a first surface of a printed circuit board and connected to a via that passes through the circuit board. According to the method, a countersink hole is created in the first surface of the printed... http://www.freshpatents.com/Printed-circuit-board-and-method-of-manufacturing-printed-ciruit-board-dt20080717ptan20080169120.php Thu, 24 Jul 2008 14:54:43 -0700 A chip capacitor 20 is provided in a core substrate 30 of a printed circuit board 10. This makes it possible to shorten a distance between an IC chip 90 and the chip capacitor 20 and to reduce loop inductance. Since the core substrate 30 id constituted by provided a... http://www.freshpatents.com/Printed-wiring-board-unit-for-method-of-detecting-rising-level-of-electrically-conductive-body-in-bore-dt20080717ptan20080169121.php Thu, 24 Jul 2008 14:54:43 -0700 A through bore penetrates through a substrate. The through bore defines a space surrounded by an insulating wall surface. A lead terminal of an electronic component is received in the through bore. An electrically-conductive body is placed in the through bore to extend to an exposed portion at the surface... http://www.freshpatents.com/Electrically-conductive-ink-electrically-conductive-circuit-and-non-contact-type-medium-dt20080717ptan20080169122.php Thu, 24 Jul 2008 14:54:43 -0700 This invention provides an electrically conductive ink comprising an electrically conductive material and a vinyl chloride/vinyl acetate/hydroxyalkyl (meth)acrylate copolymer resin. There is also provided a noncontact-type medium comprising a base material and, provided on the base material, an electrically conductive circuit formed using the electrically conductive ink, and an IC... http://www.freshpatents.com/Semiconductor-element-method-of-manufacturing-semiconductor-element-multi-layer-printed-circuit-board-and-method-of-manufacturing-multi-layer-printed-circuit-board-dt20080717ptan20080169123.php Thu, 24 Jul 2008 14:54:43 -0700 An intermediate layer 38 is provided on a die pad 22 of an IC chip 20 and integrated into a multilayer printed circuit board 10. Due to this, it is possible to electrically connect the IC chip 20 to the multilayer printed circuit board 10 without using lead members and... http://www.freshpatents.com/Padless-via-and-method-for-making-same-dt20080717ptan20080169124.php Thu, 24 Jul 2008 14:54:43 -0700 One disclosed embodiment comprises formation of a padless via in a substrate. The padless via includes a hole through a metal layer blanketing the substrate, as well as the underlying substrate. An inner wall of the padless via hole receives a seed layer of a conductive material. Electrolytic differential plating... http://www.freshpatents.com/Novel-interconnection-structure-for-improving-signal-integrity-dt20080717ptan20080169125.php Thu, 24 Jul 2008 14:54:43 -0700 The embodiment of the invention is about a novel interconnection structure which can be incorporated into a variety of connectors, as well as other types of interconnections in order to reduce crosstalk, to improve signal integrity and to achieve EM emission compliance. A 4-via (2 signal vias, 1 power via,... http://www.freshpatents.com/Electrical-component-mounting-block-and-electrical-junction-box-dt20080717ptan20080169126.php Thu, 24 Jul 2008 14:54:43 -0700 An electrical junction box includes an accommodation box having an accommodation box body having an accommodation space penetrating trough the accommodation box body up and down and an electrical component mounting block inserted into the accommodation space from either upside thereof or the underside and fixed in the accommodation space....