http://www.freshpatents.com/Metal-fusion-bonding-dtnewntc228.php USPTO Class 228 - Metal fusion bonding en-us Fri, 19 Dec 2008 00:03:54 -0800 1000 Wednesday Thursday Friday Saturday Sunday 141 31 http://www.freshpatents.com/index.php?rss=true http://www.freshpatents.com/images/freshpatentsnav_rss.gif http://www.freshpatents.com/Conductive-ball-arraying-apparatus-dt20081211ptan20080302856.php Fri, 19 Dec 2008 00:03:54 -0800 A conductive ball arraying apparatus includes an arraying jig including conductive ball insertion parts in a predetermined array pattern, a ball cup that has an opening formed in a bottom surface thereof and is capable of housing a plurality of conductive balls along with the arraying jig, moving means that... http://www.freshpatents.com/Wire-clamp-for-a-wire-bonder-dt20081211ptan20080302857.php Fri, 19 Dec 2008 00:03:54 -0800 A wire clamp for a wire bonder comprises a first arm and a second arm, which is mounted on the first arm so that it is rotatable around a predetermined axis. The first arm and the second arm each have a clamping jaw on an end distal from the axis.... http://www.freshpatents.com/Wiring-method-and-device-dt20081211ptan20080302858.php Fri, 19 Dec 2008 00:03:54 -0800 To permanently apply lead terminals to corresponding electrodes of electronic or electro-optic components, the following steps are carried out: a. providing a frame including at least one tensioned wire, b. providing a holding jig including at least one seat in which a respective one of the components can be removably... http://www.freshpatents.com/Method-of-reflow-soldering-a-printed-circuit-board-wherein-an-electroconductive-coating-material-is-used-dt20081211ptan20080302859.php Fri, 19 Dec 2008 00:03:54 -0800 A reflow soldering method for use with circuit patterns and land patterns formed by an electoconductive coating material. Reflow soldering is performed in an air atmosphere within a range of 150°-190° C. and with a preheating time set within a range of 60±30 sec. Alternatively, preheating is performed in a... http://www.freshpatents.com/Air-bearing-gap-control-for-injection-molded-solder-heads-dt20081211ptan20080302860.php Fri, 19 Dec 2008 00:03:54 -0800 An air bearing gap control arrangement for injection molded solder filler heads. Also provided is a method of providing for a gap control for injection molded solder filler heads utilizing an air bearing arrangement. Provided is a C-ring seal, at the lower or dispensing region of the solder filler head... http://www.freshpatents.com/Method-and-apparatus-for-wave-soldering-an-electronic-substrate-dt20081211ptan20080302861.php Fri, 19 Dec 2008 00:03:54 -0800 A wave soldering apparatus includes a solder supply and a first wave soldering nozzle in fluid communication with the solder supply. The first wave soldering nozzle includes a flat plate having a plurality of square-shaped openings formed therein to generate a first solder wave. An inert system is configured to... http://www.freshpatents.com/Concave-face-wire-bond-capillary-and-method-dt20081211ptan20080302862.php Fri, 19 Dec 2008 00:03:54 -0800 An improved wire bonding capillary used in the bonding of wires to the bond pads of a semiconductor device and the leads of a lead frame, the wire bonding capillary having a working tip having a working surface including a flat annular portion surrounding the wire feed aperture in the... http://www.freshpatents.com/Method-and-device-for-transferring-a-solder-deposit-configuration-dt20081211ptan20080302863.php Fri, 19 Dec 2008 00:03:54 -0800 Method and device for transferring a solder deposit configuration having multiple solder deposits onto a terminal surface configuration of a contact surface of a substrate (36) using a removal of multiple solder deposits from a solder deposit reservoir (25) accommodated in a solder deposit receptacle unit (11) via an isolation...